provides LTCC Packaging support to the customers worldwide. Glass-ceramics are fired under 1000 degrees, therefore Ag, AgPd and Au can be used as co-fired inner conductor. In addition, the signal delay becomes shorter due to low dielectric constant which is lower than Alumina substrates. Because thermal expansion coefficient of LTCC is similar to silicon, it is easy to bond die directly to the pad or to be connected flip chip.
LTCC Packaging application Areas
LED Modules
Automotive ECU
Medical Application
MCM,FLIP-CHIP,SiP
Substrate with Thin Film
Millemeter wave Products
Probe Card
RF Module, /R Module, Antenna
